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First Look at Xiaomi 18 Fold: Passport-Style Foldable Phone Featuring XRING O3 Chip

Tech04 Sep 2026 15:06 GMT+7

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First Look at Xiaomi 18 Fold: Passport-Style Foldable Phone Featuring XRING O3 Chip

The Xiaomi 18 Fold was unveiled for the first time at IFA 2026, featuring a wide foldable design reminiscent of a passport, with a 5.38-inch outer screen and a 7.58-inch inner screen. It is set to be released in China on 7 September 2026.

Xiaomi presented the actual Xiaomi 18 Fold foldable phone for the first time at IFA 2026 in Berlin, Germany, with sales planned in China on 7 September 2026. This makes Xiaomi the latest brand, after Samsung, to adopt a wide foldable phone design, with the next possible brand to follow being Apple's iPhone Ultra.Apple

The Xiaomi 18 Fold’s design stands out because Xiaomi has crafted the device to be short and wide, similar to Samsung’s style, but with more rounded corners. The left edge remains angular while the right edge is more curved.

The Xiaomi 18 Fold has a 5.38-inch outer display and a 7.58-inch inner display. The folding design is well executed, with the crease on the inner screen barely visible. The outer screen includes a single front camera, while the rear houses three cameras.

Xiaomi’s chipset is the self-developed XRING O3.

Other specifications such as battery capacity, price, and plans for release outside China have not yet been disclosed.